According to the characteristics of molding, injection mold and thermoplastic plastic mold are divided into two types. According to the molding process, it can be divided into transfer mold, blow mold, casting mold, hot molding mold, hot pressing mold (compression mold), injection mold, etc. Among them, the hot pressing mold can be divided into three types, i.e., overflow, semi-overflow and non-overflow, and the injection mold can be divided into two types, i.e., cold runner mold and hot runner mold. It can be divided into two types: mobile type and fixed type.
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The wafers developed this time are not used for semiconductor manufacturing, but are used to develop semiconductor manufacturing equipment and wafer handling equipment for 450mm wafers. Although not a single crystal, the form factor and grinding state are very similar to the actual wafer. At present, although there is a cautious choice of 450mm technology centered on device manufacturers, LSI manufacturers such as Intel still plan to start mass production in 2012-2014 (see this site report). Therefore, it is necessary to develop manufacturing equipment supporting 450mm wafers before 2008. Nissan Metals is developing the wafer at the request of LSI manufacturers.
Nippon Mining & Metals announced that it has successfully developed a 450mm diameter handling test wafer at the Isohara Plant and will officially begin sales after 2008.